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A novel micro-fabrication process for terahertz (THz) metamaterials (MMs) has been developed using S1813/LOR bi-layer stack. Desirable undercut resist profiles were created to assist lift-off process and to reduce defect level, which are frequently encountered in conventional single layer photoresist process. A series of experiments has been carried out to investigate the process conditions in order to achieve controllable undercut profiles in S1813/LOR bi-layer stack using a standard alkaline developer CD26. With the new bi-layer resist process, a large area THz MMs with high quality was fabricated and characterized by a terahertz time domain spectroscopy (THz-TDS). © 2008 Elsevier B.V. All rights reserved.

Original publication

DOI

10.1016/j.mee.2008.01.012

Type

Journal article

Journal

Microelectronic Engineering

Publication Date

01/05/2008

Volume

85

Pages

1433 - 1436