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High power RF MEMS switches have been designed and fabricated. The switches are composed of a matrix of ohmic contact cantilevers and bridges. Optimized fabrication processes have been developed to improve planarization on contact surface and reduce residual stress in switch beams, which ensure a reasonable flat and smooth cantilever and membrane bridge for operation at high RF power and low actuation voltage. Crown Copyright © 2006.

Original publication

DOI

10.1016/j.mee.2006.01.067

Type

Journal article

Journal

Microelectronic Engineering

Publication Date

01/04/2006

Volume

83

Pages

1418 - 1420