Cookies on this website

We use cookies to ensure that we give you the best experience on our website. If you click 'Accept all cookies' we'll assume that you are happy to receive all cookies and you won't see this message again. If you click 'Reject all non-essential cookies' only necessary cookies providing core functionality such as security, network management, and accessibility will be enabled. Click 'Find out more' for information on how to change your cookie settings.

A new low-cost UV LIGA process using photoresists as sacrificial layers has been developed to fabricate micromechanical components and systems. Commonly used photoresists are spun on a substrate and patterned by a mask aligner. Free-standing metal structures are built by patterning a second layer of thick photoresist and electroplating upon the photoresist sacrificial layer. Compared with all the existing sacrificial layer techniques, photoresists are easy to coat, easy to dissolve and fewer process steps are involved. The process is compatible to most of the materials and processes used in existing microfabrication technology. The precision issue of UV LIGA technique is also discussed.

Original publication

DOI

10.1016/S0167-9317(96)00207-9

Type

Journal article

Journal

Microelectronic Engineering

Publication Date

01/01/1997

Volume

35

Pages

389 - 392