Cookies on this website

We use cookies to ensure that we give you the best experience on our website. If you click 'Accept all cookies' we'll assume that you are happy to receive all cookies and you won't see this message again. If you click 'Reject all non-essential cookies' only necessary cookies providing core functionality such as security, network management, and accessibility will be enabled. Click 'Find out more' for information on how to change your cookie settings.

Stress issue in multilayered thin film structures has been investigated in the example of RF MEMS switches. Although a sandwiched thin film structure in theory can offset the stress-induced bending of a cantilever beam, it rarely possible to realize such offset because of the complexity in thin film deposition processes. Computer modeling and experiments have been conducted to reduce the unbalance of stress in a sandwiched thin film structure. It has demonstrated that a balance of stress and bending can be achieved by fine adjustment of the thickness of top layer of thin film. ©2006 IEEE.

Original publication

DOI

10.1109/NEMS.2006.334703

Type

Conference paper

Publication Date

01/12/2006

Pages

1224 - 1227